Customers
 
     
 

This is an incomplete list of customers in random order.

Intel Corp.

University of Illinois at Chicago

Singapoe Polytechnic

Engineering College Kota

Honeywell, Folsom, CA.

Wonkwang University

EMS SATCOM, Ottawa, ON, Canada

Lockheed Martin Global Telecommunications

Jadhavpur University, Kolkata, India

National Defense Academy

Oberthur CS, Caen, France

Motorola, Inc. Semiconductor Sector

Tecom, Chatsworth, California

Helsinki University of Technology

Motorola Inc., Libertyville, Illinois

Raytheon Electronic Systems

Raytheon Company

ITT Gallium Arsenide Technology Center

Symbol Technologies Inc.

Powerwave Technologies, Inc.

Texas Instrument

Raytheon Electronic Systems

Virginia Polytechnic

HuaFan University

Toyo University

Nokia

UCF, Orlando, FL

Toshiba Corp

Nokia, Mobile Phone A/S, Copenhagen, Denmark

Shibaura Institute of Technology

NASA Lewis Research Center, Cleveland, OH

HE Microwave, Tucson, AZ

Northrop Grumman, Redondo Beach

SAMEER, Numbai

Texas Instrument

Kyungpook Nat. Univ.

AGC America, Inc.

The Furukawa Electric Co., Ltd.

Allen Telecom Inc.

TRW Electronics

Seagate Technology

Xtreme Spectrum, Inc.

Univ. of California, San Diego

Garmin International Inc.

University of Houston, TX

University of Macau

Saitama University

Sony Stuttgart, Germany

Motorola Semiconductor Group, Arizona

Endwave Technology, Sunnyvale, CA

Asia Pacific Satellite Co., Ltd.

Motorola Semiconductor Products Sector, AZ

Samsung Electronic America, Inc.

Maryland Procurement Office, Hanover, MD

Univ. of New Mexico

Sanmina, San Jose, California

Qualcomm Incorporated

ITT Microelectronics, Renoke, VA.

National University of Singapore

Da-Yeh University

Panasonic MMCD of USA, GA

SDM College of Eng. & Tech., Dharwad

University of Florida

Nanowave/Ascentia,Richardson,TX

Thomson Multimedia

Motorola Personal Communications Sector, IL.

Indian School of Mine, Dhanbad

University De Rennes 1

Hebei Province Static and EM College

The Univ. of Hull

Sensys Traffic AB

Northrop Grumman, Pittsburgh, Pennsylvania

University of Zagreb

HRL, Malibu, California

Uppsala University

Matsushita Electric Components, Japan

Hankuk Aviation University

Supelec University

Electronic Research Institute

Medtronic, Inc.

Chengdu SIWI Electronics Inc.

Electro-Tech Corp.

Radio Frequency Systems

Matra Nortel, Qulmper, France

Niigata Univ.

Netherlands Foundation for Research in Astronomy

Ericsson ESPA=A, S.A.

University of Missouri, Rolla

David J. Pommerenke

Research in Motion Limited

TCI/BR Communications

LG Corporate Inst. Of Technology

National Taipei University of Tech

National Taiwan University

Jing Xin Telecommunication Technology Ltd

US Army

University of South Carolina

Chongju University

K & C Technologies, Inc., Irving, TX

Osaka University

Ecole Polytechnique France

MDC/CSIST, TAIWAN

Rockwell International

Alcatel CIT, Marcoussie

Israel Aircraft Industries, Israel

Sharp

Mobile Mark, Inc., Schller Park, IL

Delco Corp. Research Lab

Heriot Watt Univ., UK

NEC Corp., Microwave & Satellite Comm. Div.

National University of Athens, Greece

Lee-Ming Institute of Tech

Intel, Hillsboro

ST Microelectronics, Crolles, France

Micro Encoder, Inc., Washington

Yokohama National Univeristy of Japan

Seoul National Univ.

ASCOM

Toshiba

National Ilan University

Kyushu Matsushita Electric Co.

TDK Corporation

Lucent Technologies, Inc. McLeansville, N.C.

Raytheon Company

Swedcom Corporation

Tatung Co.

ENSTA University

Rafsec Oy

Institut Fur Halbletterphysik Frankfurt (Oder)

Lucent Technologies, Whippany, N.J.

XETRON Corp.

Pathumwan Institute of Tech.

Oticon, Denmark

Triqunint Semiconductor

National Semiconductor, Santa Clara, CA.

Benetel Ltd.

SAMEER, Numbai

Okanagan University Colledge

Alcatel Business Systems

University of Maryland

NEC-Saitama

Takusyoku University

University of Victoria

New Focus, Inc.

Panasonic, Moriguchi-Osaka

Korea University

Raytheon Electronic Systems

Home Wireless Networks, Inc., Norcross, GA

Antenna Giken Co., Ltd.

Quintel Technology Limited, UK

Panasonic Industrial Company, San Diego, CA.

Varian Associates

Toshiba

Hughes Space and Communications, Los Angeles, CA.

USDOE Special Technology Labs

Forchungszentrum Julich GmbH

NTT Access Network Service Systems Labs.

Panasonic Mobile Communications

Raytheon TI Systems

Hughes Research Lab., Malibu, CA.

Ambedkar Institute of Tech. New Delhi, India

National Changhua University

Research Triangle Institute

Radio Research Laboratory

Matsushita Comm. Industries, Inc., Japan

Matsushita Communication Kanazawa R & D Labs., Co. Ltd.

NEC-EMC Technical Center

Fractus, S. A. Spain

Korea Maritime University

University of Dublin

Harris Corp., Electronic Systems Sector, Melbourne, FL

Bennari Amman Institute of Technlogy

California Eastern Labs., Santa Clara, California

Korps Landelikjke Politiediensten

Raytheon Electronic Systems

Spectrain Corp.

Bridgewave Communications, California

Communications Research Centre, Ottawa

King Mongkut's Institute of Tech. North Bangkok

Alien Technology Corp.

Kyonggi University

University of Southern California

Sandia National Labs

Motorola, Inc., Albuquerque, New Mexico

BSA Crescent Engineering College, Chennai, India

Thomson Multimedia

Taganrog State Univ. of Radioengineering

PCTELL, Maxrad Product Group

Samsung Electronic Co.

Video54 Technologies, Menlo Park, CA

Ecole Polytechnique, Nantes

Lumera Corp., Bothell, WA

University of Missouri_Columbia

Chaparral Communications Inc.

US Monolithics

National University of Singapore

South China Univ. of Science, Guangdong, China

Optowave Laboratory Inc.

Geogia Institue of Technology

NASA JFK

Skyworks

Preco Electronics, Inc., Boise, ID

Optomic Microwave Ltd.

Superconducting Core Technology

Tampere University of Technology

Intermec Technologies Corp., N.Y.

National Taipei University of Tech

Hughes Aircraft Corp., Malibu, CA.

MTI Technology, Israel

National Taiwan University of Science and Technology

EE Dept., National University of Singapore

The Univ. of Warwick

Cicada Semiconductor, Austin, TX

Cray, Inc., Chippewa Falls, WI

Setsunan Univ.

Temasek Polytechnic

Accton Technology Corp.

Hewlett Packard Co., Boise, IDAHO

DEMSO Corporation, Tokyo

Hong Kong Polytechnic Univ.

Tsukuba Univeristy

Maxrad, Hanover Park, IL

Dr. Babasaheb Ambedkar Technology Univ., Lonere, India

MicroPulse, Camarillo - CA.

Nanyang Technological University

KENTRON, Centurion

ITT Gilfillan, Van Nuys, CA.

Motorola Inc., Schaumburg, Illinois

Compaq

Matsushita Electric Components, Japan

Lucent Technologies, Breinigsville, PA

Vaisala Oyj

Japan Defense Agency

Bouygues Telecom (Velizy)

Dekolink Wireless, Ltd.

ISRO Satellite Center, Bangalore

Simon Fraser University

Mark Gorbett for personal uses

SD School of Mines & Tech, Rapid City, SD

Pennsylvania State University, PA.

Lucent Technologies, Reading, PA

Nanjing Univ. of Technology

Virginia Polytechnic

AUX Israel Limited

Kwang-Woon University

Sony Research Lab

Max-Planck-Institut Fur Radioastronomie

DUNE Medical Devices

ETRI

University of Utah at Salt Lake City

Tampere University of Technology

International Systems, LLC., CA.

Tcom Communications

Royal Military College

ComDev, Inc.

Discovery Semiconductor, Cranbury, NJ

SGS-Thomson

National Central University, Taiwan

LAAS-Universite Paul Sabatier

Epcos, Munich, Germany

Nokia Mobile Phones, Ltd., Salo, Finland

W5Network, Inc.

Lucent Technologies, Allentown, PA

Elect. And Telecom. Research Inst.

Fortuna

NEC Corp.

APIC Corp., Culver City, California

Saitama University

U.of Colorado at Boulder

Samsung Microwave Semiconducter

STMicroelectronics, Rousset, France

Nomadic Communications Pty. Ltd., Australia

Huges Aircraft Corporation, CA

Centro Tecnico Aeroespacial

NTT, Tokyo

The Aerospace Corporation

Yonsei Univ.

Hong Kong Univ. of Science & Techonolgy

Alpine Microsystems

Tsinghua University

Bharatiya Vidyappeth, India

Intel Corp, Chandler, Arizona

University of Moratuwa

University di Roma

Yuan Ze University, Taiwan

Spectrain Corp.

Electronic Technical Lab

Delhi College of Engineering

Kyoto Samaler Business Consulting Corp.

King Abdulaziz City for Science and Technology

Delco Electronics Systems

University of South Florida

PCTELL, Maxrad Product Group

Univ. of Kent at Canterbury

Univ. of Missisippi

National Huwei Institute of Tech., Taiwan

Furukawa Electric Co., Ltd.

Triqunint Semiconductor

Thrane & Thrane A/S

Siemens AG

Univ. of Zaragoza

Universidade de vigo

Delphi Delco Electronics Systems

Polycom, Inc. San Jose, CA.

Intel, Sacremento

Madhav. Instit. Of Tech. And Sci.

Jaybeam Wireless, Hickory, North Carolina

The Univ. of the South Pacific, Fuji

University of Pretoria

Racal Antennas Limited

MARDEL, Vence, France

McMaster University, Canada

Czech Tech. University in Prague

Los Alamos National Lab., Los Alamos, NM

Chonbuk Sanup University

SAMEER, Kolkata, India

Tsinghua University

NTTR Chandigarh, India

Nortel Networks, Ottawa, Ontario, Canada

Bengal Engineering and Science Univ.

National Taipei University of Tech

Universiti Kebangsaan Malaysia

Matsushita Comm. Insustries, Inc., Japan

Panasonic, Tokyo

Yosu National Univ.

Nokia, Mobile Phones A/S, Denmark

Korea Mobile Telecom

SungKyunKwan University

AOC - Tokyo

Belgian Electronic Reasearch S.A.

Villanova University

University of Illinois

University of Manitoba, Canada

Osmania University,Hyderabad India

Nanjing University. Of Science and Tech., P.R. China

Malibu Networks, Calabasas, CA

Motorola Corp. Government & Systems Technology Group

Texas A&M University

University of California, Irvine

Anna Univeristy Chennai, India

University of Missouri_Columbia

Ball Aerospace & Technologies Corp.

Macquarie Univ, NSW, Australia

Sandia National Labs

Prolincx Corp.

Siemens AG

Nokia Corporation, Finland

Kum Oh University

American Meter Company

Enabling Technology, CA.

Univ. of Melbourne, Australia

Amant, Reno, NV

Antenna Section, CSIST

Harris Corp., Quincy, IL.

Finisar Corp., Sunnyvale, CA.

Royal Military College

Triqunint Semiconductor

Saitama University

Cyrix Corp., Richardson, TX

Nippon Dengyo Kosaku Co

Light Technologies Pty. Ltd

Triqunint Semiconductor

Ericsson Mobile Communications AB, Stockholm

DELTEC Telesystems Intern., Ltd.

Moteco AB, Lund, Sweden

Zeland Software, Inc. (For Internal Use)

Brno Univerisity of Technology

Sandia National Labs

ENST de Bretagne

BroadCom Corp.

Xilinx Corp.

CTS Microelectronics, West Lafayette, Indiana

Veltore Institute of Technology, Veltore

University of Central Florida

Ansan 1 College

Technical University of Denmark

NeoPac Semiconductor, Inc. - Pleasanton, CA.

Intel, Dupon

Radiall Inc., Vancouver, WA

IBM., Hopewell Junction, N.Y.

Norfolk State Univ., Norfolk, Virginia

The John Hopkins University

Motorola Inc., Tempe Arizona

Pohang University of Science and Technology,

Westinghouse Electric Corporation

University of New Mexico

Heinrich-Hertz-Institute, Berlin

Han Yang Univ. Korea

ITT Gallium Arsenide Technology Center

Veltore Institute of Technology, Veltore

SkyGate Telecom

Phiar Corp., Boulder, CO

National Atmospheric Research Lab., Tirupati, India

Tech. Edu. Instit. Of LAMIA

IQ Mobil-Bartels Mangold Electronics GmbH,

Punjab Engineering Colleage, India

Federal Bureau of Investigation, Virginia

Tsukuba Univeristy

Bell Helicopter Textron

Ministry of Defense, Israel

NASA Langley Research Center, Hampton, VA

University of Oulu

Border Technikon, East London

Univ. of Ottawa

Radio Waves, Billerica, MA

Autoliv, Motala, Sweden

R&D Microwaves LLC, Newark, NJ

Metatek, Ltd., Moscro, Russia

National Chi Nan Univerisity

NEC Information System

PJMicrowave, Oulu, Finland

University of Massachusetts Dartmouth

Program System Institute, Ressian Academy of Science

Anritsu Corp.

STI-CO Industries, Inc.

Aimta Inc.

Panasonic, Tokyo

NIT, Trichy of india

Peregrine Semiconductor, San Diego, CA.

Asahi Glass Co. Ltd

V.E.S. Inst. Of Tech., Numbai, India

McDonnel Douglas, Saint Louis, MD

TCI/BR Communications

Ericsson Mobile Communications AB, Lund

TRW Electronics

Tokyo Denki Univ.

Panasonic Mobile Communications

Sharp

Matsushita Electric Components, Japan

National University of Singapore

Pennsylvania State University, PA.

National Institution of Information and Communications Technologies

Vrije Universiteit Brussels

University de Santiago de Compostela

Radant Technologies, Inc.

Nera SatCom AS, Varemottak

Universitatea Politehnica din bucure

Smarteq Antenn AB

Omega Wireless Solutions, Inc.

Azonic Systems, Inc.

Shizuoka University

IceFyre Semiconductor, Inc.

Lucent Technologies , Ireland

Raytheon TI Systems

Griffith Univ., Australia

Singapoe Polytechnic

Tatung Co.

Motorola Cellular Subscriber, Bathwell, WA

Institut National Polytechnique De Grenoble

Inchun University

Raytheon Company

Yuan Ze University, Taiwan

Thomson Multimedia

Lasair Design, Vista, CA.

Tsinghua University

Alcatel Telspace, Toulouse

Univ. Estadual de Campinas

Superior Modular Products

Motorola Inc., Mundelein, Illinois

Linear Technology, Milpitas, CA.

T & M Engineering, Inc.

Maxrad, Hanover Park, IL

Texas Instrument

Virginia Tech.

Hitachi America Ltd, Brisbane, CA.

Radionet Ltd., Espoo, Finland

NTU of Singapore

The Instittue of Space and Astronautical Science

Research & Educational Society in Information Technologies

Institute of Northwest Mechanical and Electrionical Engineering

NTT Labs, Tokyo

Windermere Information Technology Systems

Nanjing Communication University, China

Royal Military College

Institute of Remote Sensing, China

Chung-Ang University

NET-P.N. Headquarter, Malta

Axiom Microdevices, Inc.

Technical University Eindhoven

University of South California

Kyocera Wireless Corp., San Diego, CA.

TDK Semiconductor

National Taiwan University

Sri Venkateshwara Univ., Tirupati

Hartenstein Associates, Chatsworth, CA

Technical University of Lisbon - Portugal

Matsushita Electronic Compoents, Japan

CSIST

University of Missouri_Columbia

OpNext, Thousand Oaks, California

Texas A&M University

Hughes Research Lab., Malibu, CA.

Microlab Corp, Livingston, New Jersey

MicroTech Specialist, Inc., Novato, CA

France Telecom R&D, Meylan, France

TDK Corporation

Hindustan College of Eng., Chennai

Wu-Fung Inst. Of Tech.

Polytechinc Univ. of Valencia

Seoul National Univ.

Harris Corp. MCD, Durham, NC

KAIST

Nan-Tai Institue of Technology, Taiwan

Gabriel Electronics, Inc. Scarborough, ME

XEMOD

Tamkang University

University of Pretoria

Innsbruck University

Boeing Company

Sony

NERIST

Asansol Engineering Colleage, Asansol, India

Skyworks

University of New Mexico

VSSC, Trivandrum, India

Supelec University

The Consortium, Integrated Mine Safety Systems

Chien Kuo Institute of Technology

BenQ Mobile

Lappeenranta University of Technology

Singapoe Polytechnic

US Army Fort Huachuca

Galtronics Ltd

Kyushu University

C & k Systems, Inc., Sacramento-California

Virginia Polytechnic

Microwave and Antenna Systems (India) Pvt Ltd

PARATEK, Columbia, Maryland

Cochin Univ. of Science and Tech.

Nortel, Kanata, Ontario, Canada

Mitsutoyo Corporation, Japan

Siemens AG

Federal University of Maranhao

Nokia Corp. Salo, Finland

Swiss Fed. Inst. Of Tech. (ETH)

U. of California at Berkeley

University of Nottingham

Texas Instrument

Chiba University

Ericsson Corp., North Carolina

Raytheon TI Systems

The Chinese Univ. of Hong Kong

IBM Encinitas

Queen's University

National Chin Yi Institue of Technology

NTT Network Innovative Labs.

MIT, Lincoln Lab.

Radio Waves, Billerica, MA

Research in Motion Limited

Politechnika Poznanska, Poland

SmartAnt Telecom Co.

Florida Institute of Technology

Mark IV Industries, Ltd., Ontario - Canada

SS Jain Subodh PG College, Japur

Denki Kogyo KK.

Raytheon Company

Celeritek, Santa Clara, California

Marvell Semiconductor, Inc.

High Tech Computer Corp.

CWC, National University of Singapore

Tsinghua University

Triqunint Semiconductor

U. of California at Berkeley

Hitachi Cable Ltd.

Polytechnic Univ. of Barcelona

Toshiba

Radcom, Inc. Cupertino, California

DSO National Laboratories

Saitama University

Nokia, R & D (UK) Limited, Surrey, UK

Shibaura Institute of Technology

Pennsylvania State University, PA.

Hughes Aircraft, Torrance, CA.

Maryland Procurement Office, Ft. Meade, MD

National Chen-Kung University

Hewlett Packard Co.

Nanyang Polytechnic

Omnipless, Hout Bay, South Africa

Magellan System Corp., CA

Kumamoto

Bigbear Networks

Texas A&M University

NASA Glen Research Center, Cleveland, OH

Shu-Te University

Hitachi Kokusai Electric, Inc.

Indian Inst. Of Science

Texas Instruments AS

Raytheon Company

NASA, Ohio

Siemens AG

Alenia Spazio S.P.A., Rome

Multilink Technology Corp., CA.

Sinclair Technologies, Inc.

I-Shou University

VirtualTechnology Partners

Sagem, Eragny, France

University of Michigan, Ann Arbor, Michigan

Nokia Mobile Phones, Ltd., Finland

Elektrobit Microwave Oy, Oulu, Finland

Univ. of California, San Diego

University of New Mexico

Infineon, Munich, Germany

Thales

Micron Technologies, Boise Idaho

Nippon Ericsson, K.K.

Indian Institute of Technology

Nokia Mobile Phones Ltd., Finland

RF Micro Devices

Univ. De Sevilla, Sevilla, Spain

SHARP Corp.

Erciyes University, Turkey

Sony Stuttgart, Germany

Thales

Intel, Shanghai

Raytheon Company

Cassel Innovation AB

Motorola Inc., Libertyville, Illinois

Politechnika Bialostocka

Intel, GIGA ApS

CalTech

Nokia, R & D (UK) Limited, Surrey, UK

Nokia Research Center, Helsinki, Finland

University of Kentucky

InTenna Technology AB

Chung Shan Inst. Of Science and Tech.

Antcom

Digital Microwave, San Jose, CA

Chung Buk National University

Bechtel Nevada

Naval Air Warfare Center, China Lake, CA

Yildiz Teknil University

U. of California at Berkeley

Novatel, Inc., Calgary, AB, Canada

Nagasaki University

Texas Instrument

Nokia UK Limited, Farnborough, U.K.

Univ. of Karlsruhe

Seiko Epson

Triqunint Semiconductor

Osmania University,Hyderabad India

Microwave dB, Inc., Newbury Park, CA.

Panasonic, Inc. Kyoto Factory

Ericsson Microwave Systems AB, Molndal

University of Missouri_Columbia

G-Plus, Inc.

University of Missouri_Columbia

National Center for High Performance Computing, Taiwan

CSS Antenna, Inc.

Saitama Institute of Tech.

Thomson-CSF Microelectronique

Meerae, Tech, Inc., Korea

Fraunhofer Gesellschaft

Birla Institute of Technologies

Huyndai Electronics America, CA.

NSYSU, Kaoshiung, Taiwan

Far East College, Taiwan

Space Systems/Loral, Menlo Park, CA.

Moteco AB, Singalore

Lucent Bell Labs., Murray Hill, New Jersey

IEMN University, Lilles, France

University of South Carolina

spectral_systems, Inc.

Thomson Multimedia

ASK, France

Furuno Electric Co. Ltd

Sony Ericsson Mobile Comm.

Marquis Microwave Products, Inc., Hoffman Estates - Illinois

Flextronics International AB

ENI Technology, Inc.

Osaka Prefecture Univ, Japan

Senis Corp.

VTT Technical Research Centre of Finland

NTT DoCoMo, Inc.

Univ. of Zagreb

CSC/Technology Management Group, VA

SPAR Aerospace Limited

Philips GmbH Forschungslaboratorien

Electromagnetic Group

Polytechnic Univ. of Barcelona

Marconi Communicatins GMBH, Backnang, Germany

RCI, Hyderabad

Andrew Corporation, Addison, Illinois

Israel Institute of Technology

Kotura, Inc., Monterey Park, CA

California Micro Devices

WanShih Electronic Co. Ltd.

Sandia National Labs

Tatung Co.

US Monolithics

Larsen Electronics Vancouver, WA.

Ministry of Science and Technology, Brazil

Rambus

Instituto De Astrofisica De Canarias

Bosch Telecom, Inc.

Daimler-Benz Aerospace, Dornier GmbH

Kyoto Univ., Japan

RF Micro Devices

Hollands Singnaalapparaten B.V.

Hughes Aircraft Corporation, Malibu, CA.

Panasonic Communications

Texas A&M University

NEC Mobile Termnal Division

Queen's University

Valentine Research, Cincinnati, OH

Solectron, Quimpere, France

Rajamangala Institute of Technology

National Kaohsiung Univ. of Applied Science

Hughes Aircraft Corporation, Tucson, AZ

DLR, Germany

National Chiao-Tung University HsinChu

Technical Univ. of Ilmenau

Chaitanya Institute, Hyderabad

LG Electronics, Inc.

iCREDO Technologies Pte Ltd.

Sansei Electric Corp.

SHARP Corp.

Celight, Inc., Silver Spring, MD

Materials Research Labs./ITRI, HsinChu, Taiwan

MIT Lincoln Laboratory, Lexington, MA

Univ. of Missisippi

Montana State Univ, Bozeman, MT

Fundacao Casimiro Montenegro Filho, Brazil

Lemo-Enserg, Grenoble, France

Racal Antennas Limited

Sharp Corp.

Communication Research Labs.

TenXc Wireless, Kanata, ON, Canada

Intel, Hudson, MA

Carant Antenn AB

Duke University

Rafael

Taganrog State Univ. of Radioengineering

Tohoku Gakuin Univ.

Seoul National Univ.

SkyGate BG

Anten Corp.

Polytechnic Univ. of Valencia

Asiana IDT, Seoul, Korea

Hanyang University

Andrew Corporation

Hongik University, Korea

CSIRO, Australia

Temasek Polytechnic

University of California, Irvine

U. of California at Davis

Panasonic, Tokyo

NASA GSFC, Greenbelt, MD

Indian Inst. Of Technology, Bombay

Triqunint Semiconductor

University of Electro-Communications

CRC, Industry Canada

DRDL, Hyderabad

Emcore Corp., Albuequeque, NM

Thomson Multimedia

Univ of Liverpool

Univ. Estadual de Campinas

National Center for High Performance Computing,

U. of California at Berkeley

Guangzhou Anxin Technology, Ltd.

Kanazawa University

MDC/CSIST, TAIWAN

Visteon Information

City University of Hong Kong

Pennsylvania State University, PA.

Pohang University of Science and Technology,

Sibeam, Inc, Sunnyvale, California

GIGA, Skoviunde, Denmark

Filtronic LK Oy, Kempele

Ampheonol Socapex

General Dynamics

Lucent Technologies, Inc. Holmdel, N.J.McLeansville, N.J.

Nokia Mobile Phones Ltd, SALO, Finland

Intel, Israel (1974) Ltd., Haifa

RF Industries Pty Ltd.

Ericsson Mobile Communications (UK) Ltd.

University of Arkansas

RWTH Aachen University of technology

Fakulti Kejuruteraan Eletrik, Univ. Tekno, Malaysia

Highgain Antenna Co. Ltd.

Fortune Instit. Of Tech. Taiwan

Chinese Air Force Academy, Taiwan

Physics Dept., National University of Singapore

Dongkuk University

Institute for Infocomm Research

Supelec University

TDK Ireland

Preco Electronics, Inc., Boise, ID

Nat. Taipei Univ. of Tech.

Allgon TA AB, Akersberga

LRDE, - India

Chinese Military Academy

Valeo Switches/Raytheon

Florida International University

Oscillated Recall Technology, Inc.

Panasonic-Giken, Tokyo

Sony Ericsson Mobile Comm.

Korea Electric Power Corporation

Rajamangala Institute of Technology

NICT Singapore

Nanjing Electronic Device Institute, Nanjing

Yuan Ze University, Taiwan

Nokia

Banaras Hindu University

University of Quebec

IER, France

Triqunint Semiconductor

Ecole Polytechnique Montreal, Montreal

CMERI, Durgapur, India

H.S.I., Stellenbosch, South Africa

TX RX Systems

Nokia Mobile Phones Production GmbH, Germany

RF Technologies, Inc.

Univ. of Illonis at Chicago

Valeo , Bietigheim-Bissingen, Germany

University of Waterloo

Matshushita Communication Kanazawa R&D Labs., Co. Ltd.

Nokia Japan

University of Central Florida

Inphi Corp.

Epsilon Lambda Electronic Corp.

Univ. of California, Los Angeles

NEC Corp.

LG Inform. And Comm., Limited

RADWAR S. A.

Center for Airbone System

ADE, Bangalore, India

Raytheon Company

Chungnam University

University of Illinois

MREC,Jaipur of India

Universidad De Macau

Fujitsu Compound Semiconductor, Inc.

Florida International University

Chung Cheng Institute of Tech.

Panasonic Communications

Samsung Electronic Co.

Conductus, Inc., Sunnyvale, CA

Swiss Fed. Inst. Of Tech. (ETH)

RWTH Aachen University of technology

PARATEK, Aberdeen, Maryland

Chang Gung University, Taiwan

FGUP RNIIRS

Hacettepe Univ

Radiacion Y Microondas S.A.

Katholieke Univ. Belgium

Kuwait University

Texas Instrument

University of Mining & Metallurgy, Poland

STI

GE Power Controls India Pvt Ltd.

YRP

Gyungsang National University

Micron Technology, Inc. Boise, Idaho

Central Research Laboratories

SiGe Semiconductor

Raytheon Electronic Systems

ATR Adaptive Communications Research

Universite de Nice - CNRS, France

BITS, Ranchi

Queen's University Dept. of ECE

Okayama University

Panasonic MMCD of USA, GA

Tohuku Gakuin Univ

ITRI, Milpitas, CA.

Hosei University

IBM - T.J. Watson Research Center - Yorktown, NY.

Rantec Corporation

University of Central Florida

MobileComm Communications Ltd., Yavne, Israel

Queen's University

Panasonic Mobile Communications

RFIT University

Ben-Gurion Univ. of the Negev.

SAC

Soongsil University

Luxtera, Inc.

Silverback Systems, Inc.

Thesys-Intechna

Aju University

US Airforce, Hanscom AFB

Universitat of Politecnica Valencia

National Defense Academy

Shizuoka University

Technology Sources Ltd.

Bell-Northern Research Ltd.

Spectral Solutions, Inc.

ITRI Comp. & Comm. Research Lab., Hsin Chu

Singapoe Polytechnic

Manchester University

StrataLight Communications, Campbell, CA

Qualcomm Incorporated

University of Stellenbosch

Korean Electronics Technology Institute

Intel Corp, Sacramento, California

Fractal Antenna Systems

Raytheon Company

COMSAT Laboratories, Clarksburg, MD

NTT Labs, Tokyo

I OF AB, Sweden

National Institute of Science and Technology, Berhampur, India

Menoufia Univ. Egypt

Gain Microwave

University of Patras, Greece

Raytheon Company

Seoul National Univ.

Scintera Networks, Inc.

U. of California at Davis
NHK, Tokyo,

Gilat Satellite Networkds, Ltd.

Curtin Univ. of Technology

Nokia, San Diego, CA.

Korps Landelikjke Politiediensten

Emscan Corp.,

Q-Free ASA

Optowave Laboratory Inc.

Lucent Technologies, Holmdel, N.J.

Intercollege, Cyprus

Royal Military College

Pennsylvania State University, PA.

Central Research Laboratories

Pohang University of Science and Technology,

intern. Islamic Univ. Malaysia

Holon Academic Institute

Yarmouk Univ. Jordan

Amalfi Semiconductor
Netaji Subash Instit. Of Tech., New Delhi

SAC

National Research Council

Kongsberg Defence, Sweden

Applications Militaires, France

ANTENNESSA, Plouzane

Catamaran Communications Inc.

Praxis, Inc., Virgina

INCD-IMT

Samsung Microwave Semiconducter

SAMEER

Motorola, Inc.- Ft. Lauderdale, FL.

Szilagi Consulting

Integrated Module Technology, Inc.

Harada Corporation

KVH Industries

Net Personix Corp.

Conexant Systems, Newport Beach, CA

AGC America, Inc.

Swedcom Corporation

Hughes Space and Communications, Los Angeles, CA.
National Taiwan University

Nippon Univ.

Ecole Superieure D'Incenieurs De Beyrouth

Hong Kong Univ. of Science & Techonolgy

ASAT, Inc.

Tubitak, Marmara Research Center, Turkey

Royal Military College

Tower Six for rental use

Tenatronics Limited

Kinsun Industries, Inc., Taiwan

Incheon University

Kasten Chase Applied Research, Canada

M/A Com. Med., Lowell, MA