Signal line width W1 = 0.1 mm, thickness = 0.025 mm. Signal line to ground distance h = 0.2 mm

Ground plane separation = 0.6 mm. Via dimension, W2 = 0.15 mm

Ground plane pitch dimension L = 0.5 mm

The whole space is filled with dielectrics er = 9.5

No OLV'S: only the meshed ground plane and a x-signal line

Y-lines: meshed ground plane with a x-signal line and a y-signal line.

Vias: meshed ground plane with a x-signal line and the vias.

All: meshed ground plane with a x-signal line, a y-signal line and vias.

Calculate the characteristic impedance and capacitance of the x-signal line in the structures

Information on IE3D

The 4 structures are simulated with 32 ports defined on the 32 terminals of the two meshed ground planes. The results can even be used to extract the RLC equivalent circuit of the meshed ground. To calculate the characteristic impedance and capacitance of the x-signal line in the structure, we need to terminate the 32 ports of the meshed ground plane to some fixed potential. The simulation time can be reduced significantly if we connect the meshed ground plane to fixed potential in the simulation.

The Quasi-TEM simulation results are from: A. C. Cangeliaris, M. Gribbons,and J. L. Prince, "Electrical characteristics of multichip moduleinterconnects with perforated reference planes," IEEE Trans. onComponents, Hybrids, and Manufacturing Tech., Vol. 16, No.1, pp. 113-118,Feb. 1993.

The Full-Wave (IBM) simulation results and measured results are from: B. J.Rubin, "An electromagnetic approach for modeling high performance computer package," IBM J. Res. Develop., Vol. 34, pp. 585-600, July 1990.

Characteristic Impedance of X-Signal Line (W)

Capacitance of X-Signal Line (PF/cm)